2 Articles
Tags :advanced-packaging
Coventor SEMulator3D 11.2: The Definitive Platform for 3D Semiconductor Virtual Fabrication Coventor SEMulator3D 11.2 is the industry-leading software solution for virtual fabrication and predictive process modeling of the world’s most advanced 3D semiconductor devices and advanced packaging architectures. As part of the Ansys portfolio, it enables process engineers, integration engineers, and device designers to build and analyze a complete digital twin of the complex 3D manufacturing process flow. By emulating hundreds of sequential process steps (deposition, etch, CMP, lithography), SEMulator3D predicts the exact 3D geometry, electrical parasitics, and structural variations that will result on the silicon wafer, long before committing to costly and time-consuming fab experiments. Core Philosophy: “Fab-in-a-Box” for Predictive Process Development SEMulator3D’s power lies in its rule-based, voxel...
Cadence Integrity 3D-IC 2025: The Unified Platform for Next-Generation Heterogeneous Integration Cadence Integrity 3D-IC 2025 is the industry-leading electronic design automation (EDA) platform specifically architected for the complexities of designing modern three-dimensional integrated circuits (3D-ICs) and multi-chiplet systems. It provides a cohesive, start-to-finish environment that unifies system-level planning, physical implementation, and signoff analysis—a critical requirement for managing the interdependencies of power, performance, thermal, and cost in advanced packaging. Core Functionality & Key Features: 1. System-Level Planning & Architecture Exploration This module enables early-stage decision-making, which is crucial for cost and performance. Chiplet Partitioning & Stacking Exploration: Allows architects to evaluate different die partitioning schemes, 2.5D/3D stacking options, and interposer configurations to optimize for performance, power, and manufacturability. System Performance &...
