Tags :Power Integrity Signoff

Synopsys Totem 2026: Power Integrity & EM/IR Signoff for AMS Designs Synopsys Totem 2026 is the industry’s gold-standard voltage drop (IR) and electromigration (EM) sign-off solution for transistor-level and mixed-signal designs, trusted for thousands of tapeouts and certified by major foundries for nodes down to 1.6nm . The 2026 release enhances its capabilities through the Totem-SC variant, delivering significant performance breakthroughs for analog/mixed-signal (AMS) design signoff. Key New Features in the 2026 Release Elastic Distributed Computing (Totem-SC) The major highlight is the introduction of elastic distributed computing in Totem-SC . This enables AMS signoff tasks to achieve up to a 10x speedup by automatically distributing large-scale signoff tasks across multiple compute nodes . The key innovations behind this performance leap...

Ansys RedHawk 2025 for Linux | Leading Power Integrity & Reliability Signoff Platform for SoCs Ansys RedHawk 2025 for Linux is the industry-standard, Linux-native software for comprehensive power integrity, reliability, and thermal signoff of advanced system-on-chip (SoC) designs. It provides scalable, high-capacity analysis for digital, mixed-signal, and 2.5D/3D-IC designs at the latest process nodes. Core Functionality Overview: Full-Chip Power & Signal Integrity Signoff: Delivers golden-signoff accuracy for dynamic and static IR drop, electromigration (EM), and power noise analysis for digital SoCs, supporting the largest and most complex designs. Thermal & Electrothermal Analysis: Features advanced thermal analysis for 2.5D and 3D-IC packages, evaluating chip-package interaction (CPI) and thermal-induced reliability risks for multi-die systems. High-Performance Scalable Engine: Leverages massively parallel architecture for...