Tags :SPICE Simulation

Siemens Solido Simulation Suite 2025: AI-Accelerated Custom IC Verification The Solido Simulation Suite 2025 is Siemens EDA’s comprehensive, AI-powered solution for the simulation and verification of custom analog, mixed-signal, RF, and memory integrated circuits (ICs). It integrates advanced SPICE, FastSPICE, and mixed-signal simulators into a unified platform, leveraging AI to accelerate verification tasks for next-generation designs. Key New Features & Capabilities AI-Accelerated Verification Order-of-Magnitude Speedup: The AI-driven Solido Sim AI and Solido LibSPICE can deliver significant reductions in simulation time. In a collaboration with Samsung Foundry, this technology enabled a 14x speedup in standard cell library verification by reducing the required simulation samples by 80% while maintaining high accuracy. Automated Workflows: One-click automation replaces manual processes, transforming tasks like parameter...

Tanner Tools 2024.3 for Linux | Comprehensive IC & MEMS Design Suite Tanner Tools 2024.3 for Linux is a complete, Linux-native integrated circuit (IC) and MEMS design suite, providing an end-to-end flow from schematic entry and simulation to physical layout and verification for analog/mixed-signal, power management, and MEMS devices. Core Functionality Overview: Full-Custom Analog/Mixed-Signal Design: Integrated environment for schematic capture (S-Edit), SPICE and FastSPICE simulation (T-Spice), and physical layout (L-Edit) with design rule checking (DRC) and layout vs. schematic (LVS) verification. MEMS & Multi-Domain Simulation: Specialized tools for designing and simulating micro-electro-mechanical systems (MEMS), enabling co-simulation of mechanical, thermal, and electrostatic effects within the IC design flow. Advanced Verification & Interoperability: Includes parasitic extraction, post-layout simulation, and support for industry-standard...